Low

ICK BGA 35X35X10 - 

Heat Sink, For Ball Grid Array, BGA, 15.7 °C/W, 10 mm, 35 mm, 35 mm

ICK BGA 35X35X10 - Heat Sink, For Ball Grid Array, BGA, 15.7 °C/W, 10 mm, 35 mm, 35 mm
ICK BGA 35X35X10 - Heat Sink, For Ball Grid Array, BGA, 15.7 °C/W, 10 mm, 35 mm, 35 mm

Image is for illustrative purposes only. Please refer to product description.

Manufacturer Part No:
ICK BGA 35X35X10
Order Code:
1892312
Technical Datasheet:
(EN)
See all Technical Docs

Product Information

:
BGA
:
15.7°C/W
:
10mm
:
35mm
:
35mm
:
-
:
Aluminium
:
0.39"
:
1.38"
:
1.38"
:
-
:
-
Find similar products Choose and modify the attributes above to find similar products.

Product Overview

The ICK BGA 35X35X10 is a Heat Sink made of aluminium with black anodised finish. It is suitable for use with universal processors IC design BGA. It offers thermal conductive foil and thermal conductive adhesive way of fixation.
  • Universal socket
  • 3.8W Dissipation loss (Pv)

Applications

HVAC, Thermal Management

Related Searches

34 In stock

34 available for 4 - 6 business days delivery

see cut-off times
 
Check stock and lead times
More stock available week commencing 9/04/18
HK$11.53 HK$ 11.53
Price for:
Each
Multiple: 1 Minimum: 1
Quantity Price
1 + HK$11.53
10 + HK$11.13
50 + HK$10.66
100 + HK$10.19
250 + HK$9.83
No longer stocked:: No Longer Manufactured::
Add to Basket
Total Price:
Total Price: ( )
Total Price: --

Customer Reviews

Community

Like to see information about this product from other customers?

 Read discussions, blogs, documents from our community members.

Filters:

Select document type(s) you want to see and click “Apply Filters” button
Post a question to one of our experts or start a discussion and get responses from supplier experts and fellow engineers in our community.