FISCHER ELEKTRONIK ICK BGA 35X35X10 Heat Sink, For Ball Grid Array, BGA, 15.7 °C/W, 10 mm, 35 mm, 35 mm
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- Heat Sink Material:
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- Product Range:
- No SVHC (17-Dec-2015)
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- External Diameter - Metric: -
- Packages Cooled: BGA
- Heat Sink Material: Aluminium
- Thermal Resistance: 15.7°C/W
- External Length - Imperial: 1.38"
- External Length - Metric: 35mm
- External Width - Metric: 35mm
- External Diameter - Imperial: -
- External Height - Metric: 10mm
- External Height - Imperial: 0.39"