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ICK BGA 35X35X10 - 

Heat Sink, For Ball Grid Array, BGA, 15.7 °C/W, 10 mm, 35 mm, 35 mm

ICK BGA 35X35X10 - Heat Sink, For Ball Grid Array, BGA, 15.7 °C/W, 10 mm, 35 mm, 35 mm
ICK BGA 35X35X10 - Heat Sink, For Ball Grid Array, BGA, 15.7 °C/W, 10 mm, 35 mm, 35 mm

Image is for illustrative purposes only. Please refer to product description.

Manufacturer Part No:
ICK BGA 35X35X10
Order Code:
1892312
Technical Datasheet:
(EN)
See all Technical Docs

Product Information

:
BGA
:
15.7°C/W
:
10mm
:
35mm
:
35mm
:
-
:
Aluminium
:
0.39"
:
1.38"
:
1.38"
:
-
:
-
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Product Overview

The ICK BGA 35X35X10 is a Heat Sink made of aluminium with black anodised finish. It is suitable for use with universal processors IC design BGA. It offers thermal conductive foil and thermal conductive adhesive way of fixation.
  • Universal socket
  • 3.8W Dissipation loss (Pv)

Applications

HVAC, Thermal Management

Related Searches

Awaiting Delivery

Available for backorder to lead times shown

 
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192 will be available for delivery on 20/Dec/2017

More stock available week commencing 8/01/18

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HK$11.53 HK$ 11.53
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