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MULTICOMP  509-0659  Solder Wire, Lead Free, 0.9mm Diameter, 227°C, 500g

MULTICOMP 509-0659
Technical Data Sheet (165.86KB) EN See all Technical Docs

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Product Overview

  • Contains multiple cores of rosin based flux
  • Pale coloured residues do not require cleaning
  • Extra wetting ability for faster soldering
  • For all general purpose lead-free electronic assembly and re-work applications
  • Complies with all lead-free legislative requirements

Product Information

Solder Alloy:
99.3, 0.7 Sn, Cu
External Diameter - Metric:
0.9mm
External Diameter - Imperial:
0.035"
Melting Temperature:
227°C
Weight - Metric:
500g
Weight - Imperial:
1.102lb
Product Range:
-
SVHC:
To Be Advised

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Legislation and Environmental

Country of Origin:
Malaysia

Country in which last significant manufacturing process was carried out

RoHS Compliant:
Yes
Tariff No:
83113000
Weight (kg):
.53

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