MARTIN SMT Soldering Stations & Accessories

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HT00.0119
HT00.0119 - Solder Flux, Soldering, Jar, 18 g

2352952

Solder Flux, Soldering, Jar, 18 g

MARTIN SMT

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1+ HK$405.15

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- Soldering Jar - 18g -
HT00.0117
HT00.0117 - Solder Flux, No Clean, Soldering, Bottle, 100 g

3775757

Solder Flux, No Clean, Soldering, Bottle, 100 g

MARTIN SMT

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1+ HK$1,145.94

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No Clean Soldering Bottle - 100g -
HT00.0013
HT00.0013 - Temperature Sensor, K-Type, 0.1mm, for use with 04S Mini Oven

2352980

Temperature Sensor, K-Type, 0.1mm, for use with 04S Mini Oven

MARTIN SMT

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1+ HK$457.22

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VD90.5006
VD90.5006 - Solder Pellets, for BGA Reballing, 0.6 mm, 183 °C, 47 g

2352922

Solder Pellets, for BGA Reballing, 0.6 mm, 183 °C, 47 g

MARTIN SMT

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Pack of  50000

1+ HK$1,125.65

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HT00.0009
HT00.0009 - Solder Flux, No Clean, Lead Free Soldering

3775754

Solder Flux, No Clean, Lead Free Soldering

MARTIN SMT

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1+ HK$333.38

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No Clean Lead Free Soldering - - - -
HB00.0050
HB00.0050 - Hot Plate, 230 V, Hotbeam 04, 500 W

3775739

Hot Plate, 230 V, Hotbeam 04, 500 W

MARTIN SMT

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1+ HK$15,364.02

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VD90.5009
VD90.5009 - Solder Pellets, for BGA Reballing, 0.5 mm, 183 °C, 27 g

2352926

Solder Pellets, for BGA Reballing, 0.5 mm, 183 °C, 27 g

MARTIN SMT

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1+ HK$1,134.48

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- - - - - -
DB15.0021
DB15.0021 - Filter for Vacuum Pens, Fine

2352951

Filter for Vacuum Pens, Fine

MARTIN SMT

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Pack of  6

1+ HK$611.26

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LW50.9001
LW50.9001 - KIT, REBALLING, BGA, STANDARD

2365979

KIT, REBALLING, BGA, STANDARD

MARTIN SMT

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1 Kit

1+ HK$20,548.39

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LW40.0438
LW40.0438 - Reballing Frame, BGA, 35x35mm, for use with 04S Mini Oven

2352908

Reballing Frame, BGA, 35x35mm, for use with 04S Mini Oven

MARTIN SMT

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1+ HK$3,921.45

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VD90.5005
VD90.5005 - Solder Pellets, for BGA Reballing, 0.3 mm, 183 °C, 6 g

2352937

Solder Pellets, for BGA Reballing, 0.3 mm, 183 °C, 6 g

MARTIN SMT

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1+ HK$1,125.65

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HT00.0010
HT00.0010 - Solder Flux, No Clean, Lead Free Soldering

3775755

Solder Flux, No Clean, Lead Free Soldering

MARTIN SMT

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1+ HK$333.38

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No Clean Lead Free Soldering - - - -
SF42.0002
SF42.0002 - Positioning Arm, Single Head Placer, for use with Master IXH BGA Rework System

2352944

Positioning Arm, Single Head Placer, for use with Master IXH BGA Rework System

MARTIN SMT

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1+ HK$16,287.09

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LW40.0686
LW40.0686 - Reballing Mask, BGA, 45x45mm, N:1156,762UM, for use with 04S Mini Oven

2352913

Reballing Mask, BGA, 45x45mm, N:1156,762UM, for use with 04S Mini Oven

MARTIN SMT

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1+ HK$3,851.75

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LW40.0450
LW40.0450 - Reballing Frame, BGA, 31x31mm, for use with 04S Mini Oven

2352907

Reballing Frame, BGA, 31x31mm, for use with 04S Mini Oven

MARTIN SMT

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1+ HK$3,921.45

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EB16.0002
EB16.0002 - Desoldering Iron, 300 W, 230 V AC

2352943

Desoldering Iron, 300 W, 230 V AC

MARTIN SMT

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1+ HK$13,600.92

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LW40.0236
LW40.0236 - Reballing Fixture, 45x45mm, for use with 04S Mini Oven

2352902

Reballing Fixture, 45x45mm, for use with 04S Mini Oven

MARTIN SMT

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1+ HK$3,843.02

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DV15.0012
DV15.0012 - Solder Separator, 1.4mm x 1mm, Pack of 20

2352949

Solder Separator, 1.4mm x 1mm, Pack of 20

MARTIN SMT

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Pack of  20

1+ HK$1,079.89

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LW40.0543
LW40.0543 - Reballing Mask, BGA, 45x45mm, N:1225,762UM, for use with 04S Mini Oven

2352912

Reballing Mask, BGA, 45x45mm, N:1225,762UM, for use with 04S Mini Oven

MARTIN SMT

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1+ HK$2,781.62

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VD90.5110
VD90.5110 - Solder Pellets, for BGA Reballing, 0.45 mm, 220 °C, 18 g

2352927

Solder Pellets, for BGA Reballing, 0.45 mm, 220 °C, 18 g

MARTIN SMT

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1+ HK$1,433.77

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DV15.0010
DV15.0010 - Desoldering Tip, Star Tool Placement, Desoldering, 1.4 mm

2352945

Desoldering Tip, Star Tool Placement, Desoldering, 1.4 mm

MARTIN SMT

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HB50.0004
HB50.0004 - Basic Equipment Set, 5 Piece, for use with 04S Mini Oven

2352901

Basic Equipment Set, 5 Piece, for use with 04S Mini Oven

MARTIN SMT

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1+ HK$2,211.71

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VD90.5108
VD90.5108 - Solder Pellets, for BGA Reballing, 0.4 mm, 220 °C, 12.5 g

2352932

Solder Pellets, for BGA Reballing, 0.4 mm, 220 °C, 12.5 g

MARTIN SMT

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SF30.0005
SF30.0005 - PCB Support, 40.5mm, 3mm, Pack of 4, for use with Master IXH BGA Rework System

2352982

PCB Support, 40.5mm, 3mm, Pack of 4, for use with Master IXH BGA Rework System

MARTIN SMT

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Pack of  4

1+ HK$1,002.80

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VD90.5004
VD90.5004 - Solder Pellets, for BGA Reballing, 0.25 mm, 183 °C, 3.5 g

2352939

Solder Pellets, for BGA Reballing, 0.25 mm, 183 °C, 3.5 g

MARTIN SMT

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