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Product Information
Product Overview
AS4C2M32SA-6TCN 64Mb SDRAM is a high-speed CMOS synchronous DRAM containing 67,108,864bits. It is internally configured as a quad 512K x 32 DRAM with a synchronous interface (all signals are registered on the positive edge of the clock signal, CLK). Each of the 512K x 32bit banks is organized as 2048 rows by 256 columns by 32bits. Read and write accesses to SDRAM are burst oriented; accesses start at a selected location and continue for a programmed number of locations in a programmed sequence. Accesses begin with the registration of a bank activate command which is then followed by a read or write command. An auto precharge function may be enabled to provide a self-timed row precharge that is initiated at the end of the burst sequence. By having a programmable mode register, the system can choose most suitable modes to maximize its performance. It is well suited for applications requiring high memory bandwidth.
- Fully synchronous operation, internal pipelined architecture
- Four internal banks (512K x 32bit x 4bank)
- Programmable mode, CAS latency: 2 or 3, burst length: 1, 2, 4, 8, or full page
- Burst stop function, individual byte controlled by DQM0-3
- Auto refresh and self refresh, 4096 refresh cycles/64ms
- Single +3.3V ±0.3V power supply
- LVTTL interface
- 2M x 32 org, 166MHz maximum clock
- 86-pin TSOP II package
- Commercial temperature range from 0°C to +70°C
Technical Specifications
SDRAM
2M x 32bit
TSOP-II
3.3V
0°C
-
64Mbit
166MHz
86Pins
Surface Mount
70°C
No SVHC (27-Jun-2024)
Technical Docs (1)
Legislation and Environmental
Country in which last significant manufacturing process was carried outCountry of Origin:Taiwan
Country in which last significant manufacturing process was carried out
RoHS
RoHS
Product Compliance Certificate