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                    • Reduced Price
                      1. Home
                      2. Tools & Production Supplies
                      3. Soldering Stations & Accessories
                      4. Solder Paste
                      Print Page

                      MP 100 SN62AGS90 AK 500G

                      No Clean Pin Testable Solder Paste, Tub, 179 °C, 500g

                      MULTICORE / LOCTITE MP 100 SN62AGS90 AK 500G
                      Image is for illustrative purposes only. Please refer to product description.
                      ManufacturerMULTICORE / LOCTITE
                      Manufacturer Part NoMP 100 SN62AGS90 AK 500G
                      Order Code2469715
                      Also Known AsMP 100 SN62AGS90 AK
                      Technical Datasheet

                      Data Sheet

                      See all Technical Docs
                      No Longer Stocked

                      Product Information

                      ManufacturerMULTICORE / LOCTITE
                      Manufacturer Part NoMP 100 SN62AGS90 AK 500G
                      Order Code2469715
                      Also Known AsMP 100 SN62AGS90 AK
                      Technical Datasheet

                      Data Sheet

                      Flux TypeNo Clean
                      Solder Alloy62 Sn
                      Melting Temperature179°C
                      Weight - Metric500g
                      Weight - Imperial1.102lb
                      Product Range-
                      SVHCTo Be Advised

                      Product Overview

                      The MP 100 SN62AGS90 AK is a standard alloy AGS type-3 Pin Testable Solder Paste. Multicore® MP100 medium has been formulated as a pale, soft residue product for printing and reflow in air, where process yield is critical. Effective over a wide range of printer cycle times and squeegee speeds. Excellent printer open time and between-print abandon time. Soft, non-sticky post reflow residues for reduced maintenance in-circuit electrical testing. Excellent spread on a wide range of solderable surfaces. Effective over a wide range of reflow profiles in air or nitrogen.

                      • Highly suitable for enclosed squeegee systems
                      • Version suitable for ultra-fine pitch and 0201 chips
                      • Long component tack time
                      • Resists solder balling
                      • Low colour post reflow residues for easy visual inspection
                      • High speed printing
                      • No clean

                      Applications

                      Maintenance & Repair

                      Technical Specifications

                      Flux Type

                      No Clean

                      Melting Temperature

                      179°C

                      Weight - Imperial

                      1.102lb

                      SVHC

                      To Be Advised

                      Solder Alloy

                      62 Sn

                      Weight - Metric

                      500g

                      Product Range

                      -

                      Technical Docs (2)

                      Safety Data Sheet EN

                      Technical Data Sheet EN

                      Legislation and Environmental

                      Country of Origin:
                      Country in which last significant manufacturing process was carried outCountry of Origin:
                      Hungary
                      Country in which last significant manufacturing process was carried out
                      US ECCN:EAR99
                      EU ECCN:NLR
                      RoHS Compliant:No
                      RoHS Phthalates Compliant:No
                      SVHC:To Be Advised
                      Download Product Compliance Certificate

                      Product Compliance Certificate

                      Weight (kg):.5
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