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Available to Order
Manufacturer Standard Lead Time: 10 week(s)
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| Quantity | Price |
|---|---|
| 1+ | HK$524.350 |
| 5+ | HK$485.570 |
| 10+ | HK$476.050 |
Price for:Each
Minimum: 1
Multiple: 1
HK$524.35
Line Note
Added to your Order Confirmation, Invoice, and Dispatch note for this order only.
Product Information
ManufacturerT GLOBAL
Manufacturer Part NoTGNSP-25-C30ML
Order Code2466900
Technical Datasheet
Sealant TypeGeneral Purpose Putty
Sealant ApplicationsElectrical, Electronics
Dispensing MethodSyringe
Sealant ColourGrey
Volume30ml
Weight-
Product Range-
SVHCNo SVHC (21-Jan-2025)
Product Overview
The TGNSP-25-C30ML is a non-silicone Thermal Putty suitable for use with north bridge IC. The putty is a silicone-free type spacer with 2.5W/m.K thermal conductivity. It features very low thermal resistance.
- -50 to 150°C Working temperature range
Applications
Industrial
Technical Specifications
Sealant Type
General Purpose Putty
Dispensing Method
Syringe
Volume
30ml
Product Range
-
Sealant Applications
Electrical, Electronics
Sealant Colour
Grey
Weight
-
SVHC
No SVHC (21-Jan-2025)
Technical Docs (1)
Legislation and Environmental
Country of Origin:
Country in which last significant manufacturing process was carried outCountry of Origin:Taiwan
Country in which last significant manufacturing process was carried out
Country in which last significant manufacturing process was carried outCountry of Origin:Taiwan
Country in which last significant manufacturing process was carried out
Tariff No:39100000
US ECCN:EAR99
EU ECCN:NLR
RoHS Compliant:Yes
RoHS
RoHS Phthalates Compliant:Yes
RoHS
SVHC:No SVHC (21-Jan-2025)
Download Product Compliance Certificate
Product Compliance Certificate
Weight (kg):.09