Thermal Interface Materials

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31-35-25GFN
31-35-25GFN - Thermal Insulator Bush, Nylon, TO-220, Pack of 10

936649

Thermal Insulator Bush, Nylon, TO-220, Pack of 10

MULTICOMP PRO

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-W/m.K -cm -°C/W
SPK6-0.006-00-104
SPK6-0.006-00-104 - Thermal Pad, TO3P

681090

Thermal Pad, TO3P

BERGQUIST

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1.1W/m.K 0.152mm 0.82°C/W
2015-54
2015-54 - Thermal Insulator, SIL-PAD 2000, Silicone Elastomer, White, 0.015

681118

Thermal Insulator, SIL-PAD 2000, Silicone Elastomer, White, 0.015" TH, TO-220

BERGQUIST

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3.5W/m.K 0.38mm 0.57°C/W
SIL PAD TSP K1300
SIL PAD TSP K1300 - Thermal Pad, TO220

936741

Thermal Pad, TO220

BERGQUIST

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1.3W/m.K 0.152mm 0.86°C/W
K10-104
K10-104 - Thermal Insulator, Thermal Pad, TO-3P, PI (Polyimide) Film, 1.3 W/m.K, 6 kV, 0.152 mm, 10 ohm-m

936753

Thermal Insulator, Thermal Pad, TO-3P, PI (Polyimide) Film, 1.3 W/m.K, 6 kV, 0.152 mm, 10 ohm-m

BERGQUIST

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1.3W/m.K 0.152mm 0.86°C/W
SIL PAD TSP K1100
SIL PAD TSP K1100 - SIL-PAD K-6, .006

2097550

SIL-PAD K-6, .006", TO-220, PK10

BERGQUIST

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- 0.152mm -
A15959-04
A15959-04 - Thermal Pad, TFlex HR400 Series, 1.8 W/m.K, Silicone Elastomer, 1 mm, 229 mm

2484739

Thermal Pad, TFlex HR400 Series, 1.8 W/m.K, Silicone Elastomer, 1 mm, 229 mm

LAIRD

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1.8W/m.K 1mm -
EYGS182310
EYGS182310 - Thermal Interface Material, EYG Series, 700 W/m.K, Graphite Sheet, 100 µm, 230 mm

2577470

Thermal Interface Material, EYG Series, 700 W/m.K, Graphite Sheet, 100 µm, 230 mm

PANASONIC

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700W/m.K 100µm -
120-SA.
120-SA. - Heat Sink Compound, Thermal Joint, Silicone, Oil Based, Sachet, 4g

3354076

Heat Sink Compound, Thermal Joint, Silicone, Oil Based, Sachet, 4g

WAKEFIELD THERMAL

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- - -
120-8.
120-8. - Heat Sink Compound, Silicone, Oil Based, Opaque White, 8oz, Jar

3354039

Heat Sink Compound, Silicone, Oil Based, Opaque White, 8oz, Jar

WAKEFIELD THERMAL

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- - -
CD-02-05-247
CD-02-05-247 - PHASE CHANGE THERMAL MATERIAL, TO247

2902584

PHASE CHANGE THERMAL MATERIAL, TO247

WAKEFIELD THERMAL

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- 0.0762mm 0.107°C/W
W8TR500G-0.5
W8TR500G-0.5 - Thermal Insulator, Filler Pad, 40 Shore 00, Silicone, 5 W/m.K, 1 kV, 0.5 mm, 0.17 °C/W

2289488

Thermal Insulator, Filler Pad, 40 Shore 00, Silicone, 5 W/m.K, 1 kV, 0.5 mm, 0.17 °C/W

AMEC THERMASOL

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- 0.5mm -
EYGS121810
EYGS121810 - Thermal Interface Material, EYG Series, 700 W/m.K, Graphite Sheet, 100 µm, 180 mm

2577469

Thermal Interface Material, EYG Series, 700 W/m.K, Graphite Sheet, 100 µm, 180 mm

PANASONIC

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700W/m.K 100µm -
MK3301
MK3301 - Thermal Insulator, Mica, 1 kV, 0.1 mm, TO-3 (4.37mm Bush)

520172

Thermal Insulator, Mica, 1 kV, 0.1 mm, TO-3 (4.37mm Bush)

MULTICOMP PRO

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-W/m.K 0.1mm -°C/W
65-00-GEL37-0010
65-00-GEL37-0010 - Thermally Conductive Material, Dispensable Gel, Silicone, 3.7W/m.K

3934821

Thermally Conductive Material, Dispensable Gel, Silicone, 3.7W/m.K

CHOMERICS

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- -mm -°C/W
65-00-GEL30-0010
65-00-GEL30-0010 - Thermally Conductive Material, Dispensable Gel, Silicone, 3.5W/m.K

3934801

Thermally Conductive Material, Dispensable Gel, Silicone, 3.5W/m.K

CHOMERICS

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- -mm -°C/W
EYGE0912XB6D
EYGE0912XB6D - Thermal Interface Material, EYG Series, 1.6 W/m.K, Graphite Sheet, 1 mm, 115 mm

2577450

Thermal Interface Material, EYG Series, 1.6 W/m.K, Graphite Sheet, 1 mm, 115 mm

PANASONIC

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1.6W/m.K 1mm -
ILA-TIM-LES13-2A.
ILA-TIM-LES13-2A. - Heat Sink Pad, Graphite, 240 W/m.K, 0.16 mm

3702710

Heat Sink Pad, Graphite, 240 W/m.K, 0.16 mm

INTELLIGENT LED SOLUTIONS

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- 0.16mm -
7717-178NG
7717-178NG - Mounting Pad, Round, Nylon, TO-5, 8.89 mm, 0.533 mm Thickness

1704190

Mounting Pad, Round, Nylon, TO-5, 8.89 mm, 0.533 mm Thickness

BOYD

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- 0.533mm -
A15332-01
A15332-01 - Heat Sink Pad, Gap Filler, Ceramic Filled Silicone Sheet, 228.6 mm x 228.6 mm x 2.54 mm, 1.2 W/m.K

3677516

Heat Sink Pad, Gap Filler, Ceramic Filled Silicone Sheet, 228.6 mm x 228.6 mm x 2.54 mm, 1.2 W/m.K

LAIRD

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- 2.54mm -
A15959-08
A15959-08 - Thermal Pad, TFlex HR400 Series, 1.8 W/m.K, Silicone Elastomer, 2 mm, 229 mm

2484740

Thermal Pad, TFlex HR400 Series, 1.8 W/m.K, Silicone Elastomer, 2 mm, 229 mm

LAIRD

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- 2mm -
401910023
401910023 - Thermally Conductive Material, Silicone, 1 W/m.K, 19.05 mm L x 12.7 mm W x 0.23 mm T

3518625

Thermally Conductive Material, Silicone, 1 W/m.K, 19.05 mm L x 12.7 mm W x 0.23 mm T

WURTH ELEKTRONIK

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- 0.23mm -
EYGS0811ZLGH
EYGS0811ZLGH - Thermal Interface Material, GraphiteTIM, 400 W/m.K, Graphite Sheet, 200 µm, 113 mm

2723019

Thermal Interface Material, GraphiteTIM, 400 W/m.K, Graphite Sheet, 200 µm, 113 mm

PANASONIC

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400W/m.K 200µm -
MPGCS-020NSB-150-2.0A
MPGCS-020NSB-150-2.0A - NON-SILICONE THERMAL PAD, 150X2MM, BLU

3267487

NON-SILICONE THERMAL PAD, 150X2MM, BLU

MULTICOMP PRO

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- 2mm -
CW7250
CW7250 - Heat Sink Grease, Boron Nitride, CircuitWorks®, Syringe, 3.4 g

1663190

Heat Sink Grease, Boron Nitride, CircuitWorks®, Syringe, 3.4 g

CHEMTRONICS

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- - -