Collect - Edge Devices (Sensors & Actuators)

This is the front-most device of any IoT system. It primarily works as either a sensing device to collect physical environment information, or as an actuator to control the outside world with an output. In some cases, edge devices perform a dual role, acting as both a sensing and actuating device to collect and control the physical environment.


The edge node must be connected to the outside network, either through a wired or wireless sensor node (WSN). Data integrity remains key in this block of the signal chain as many IoT systems utilize a large number of sensors to collect data and make intelligent decisions.


An edge node device provides the intelligence to sense, measure, interpret, and connect an internet gateway to the cloud. The data can be pre-processed with some form of analytics before it is transmitted for deeper data mining intelligence.


Processing nodes provides local intelligence to the entire network of sensors and applications. Typically, a processing node involves one or more microcontroller, microprocessor, hybrid circuit, etc. and may be relatively larger in size as compared to end-nodes. Processing nodes are not readily available devices; they are custom made by designers to meet the specific needs of their application.


Bigger IoT applications require a large array of edge devices in order to form a network of edge devices. In such cases, each edge device (node) needs to have a unique identifier in order to recognise and communicate with them effectively.


Typical examples of Edge Devices (Nodes):


Sensors: Temperature, Humidity, Pressure, Gas, Light, Sound, RFID, NFC, Ultrasonics, Flow Meter, Fluid, Cameras, etc


Actuators: Switch, Relays, PLCs, Motors, Light, Sound etc


Videos

TI IoT Week, Sensor Node Project

Smart Occupancy Sensor training video for IoT Solutions from Silicon Labs

Atmel: IoT-Enabled Temperature Sensor Demo

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AMG8834EK
AMG8834EK - Evaluation Board, AMG8834 Infrared Grid-EYE Array Sensor, PAN1740 Bluetooth Low Energy Module

2664539

Evaluation Board, AMG8834 Infrared Grid-EYE Array Sensor, PAN1740 Bluetooth Low Energy Module

PANASONIC

GRID-EYE SENSOR BOARD; Kit Application Type:Sensor; Silicon Manufacturer:Panasonic; Silicon Core Number:AMG8834; Application Sub Type:Infrared Array Sensor; Kit Contents:Grid-EYE Sensor Board, ATSAMD21- SMART, Bluetooth Module; Product Range:-; SVHC:No S

  • 3 available for 1 - 2 business days delivery
  • 20 available for 3 - 4 business days delivery
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  • 20 available for 3 - 4 business days delivery: (UK stock) Order before 7:35pm Mon – Fri. (Excluding National Holidays)

More stock available week commencing 28/12/20

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MAX31855PMB1#
MAX31855PMB1# - Evaluation Module, MAX31855 K-Type Thermocouple to Digital Converter, 14-Bit Output

2530496

Evaluation Module, MAX31855 K-Type Thermocouple to Digital Converter, 14-Bit Output

MAXIM INTEGRATED PRODUCTS

DEV BOARD, THERMOCOUPLE-DIGITAL; Kit Application Type:Sensing - Temperature; Silicon Manufacturer:Maxim Integrated Products; Silicon Core Number:MAX31855; Application Sub Type:Thermocouple to Digital Converter; Kit Contents:Dev Board MAX31855( K Type The

  • 51 available for 3 - 4 business days delivery
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  • 51 available for 3 - 4 business days delivery: (UK stock) Order before 7:35pm Mon – Fri. (Excluding National Holidays)

More stock available week commencing 30/11/20

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2011660
2011660 - Evaluation Module, Laser Diode Driver, Integrated Reverse Polarity Protection for IC & Laser Diode

1272670

Evaluation Module, Laser Diode Driver, Integrated Reverse Polarity Protection for IC & Laser Diode

LASER COMPONENTS

LASER DIODE DRIVER, DEV KIT; Kit Application Type:Drivers; Silicon Manufacturer:Laser Components; Silicon Core Number:-; Application Sub Type:Laser Diode Driver; Kit Contents:Evaluation Board WK Module; Product Range:-; SVHC:No SVHC (15-Jan-2019); Featur

  • 65 available for 3 - 4 business days delivery
  • 6 available for 4 - 5 business days delivery
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  • 65 available for 3 - 4 business days delivery: (UK stock) Order before 7:35pm Mon – Fri. (Excluding National Holidays)
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  • 6 more will be available on 23/10/20
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    FRDM-FXS-MULT2-B
    FRDM-FXS-MULT2-B - Evaluation Module, MMA8652FC/FXAS21002C/MPL3115A2 3-Axis Accelero/Magneto/Gyroscope

    2520442

    Evaluation Module, MMA8652FC/FXAS21002C/MPL3115A2 3-Axis Accelero/Magneto/Gyroscope

    NXP

    DEV BOARD, FREEDOM PLATFORM; Kit Application Type:Sensing - Navigation, Position; Silicon Manufacturer:NXP; Silicon Core Number:FXLS8471Q, MAG3110, FXAS21002C, MMA8652FC, MPL3115A2, FXOS8700CQ, MMA9553L; Application Sub Type:Sensor; Kit Contents:Freedom

    • 39 available for 3 - 4 business days delivery
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    • 39 available for 3 - 4 business days delivery: (UK stock) Order before 7:35pm Mon – Fri. (Excluding National Holidays)

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    BRKT-STBC-AGM01
    BRKT-STBC-AGM01 - Development Platform, FXAS21002C & FXOS8700C 9-Axis Solution, Sensor Shield and Breakout Board

    2473788

    Development Platform, FXAS21002C & FXOS8700C 9-Axis Solution, Sensor Shield and Breakout Board

    NXP

    BREAKOUT BOARD, FREEDOM INERTIAL SENSOR; Silicon Manufacturer:NXP; Core Architecture:ARM; Core Sub-Architecture:Cortex-M4; Silicon Core Number:FXAS21002C, FXOS8700CQ; Silicon Family Name:-; For Use With:NXP FRDM-K64F-AGM01 Demonstration kit; Kit Contents

    • 10 available for 3 - 4 business days delivery
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    • 10 available for 3 - 4 business days delivery: (UK stock) Order before 7:35pm Mon – Fri. (Excluding National Holidays)

    More stock available week commencing 25/01/21

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    SEK001
    SEK001 - Evaluation Kit, Trustability Pressure Sensors, Digital Output

    2772519

    Evaluation Kit, Trustability Pressure Sensors, Digital Output

    HONEYWELL

    SENSOR EVALUATION KIT, PRESSURE SENSOR; Kit Application Type:Sensor; Silicon Manufacturer:Honeywell; Silicon Core Number:-; Application Sub Type:Board Mount Pressure Sensors; Kit Contents:Sensor Evaluation Kit; Product Range:-; SVHC:No SVHC (07-Jul-2017)

    • 14 available for 3 - 4 business days delivery
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    More stock available week commencing 14/12/20

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    OM13081UL
    OM13081UL - Evaluation Module, LPC82x Capacitive Touch Solution, 8-Bit Touchpad, 9 Keys, LCD

    2471049

    Evaluation Module, LPC82x Capacitive Touch Solution, 8-Bit Touchpad, 9 Keys, LCD

    NXP

    DEMO BOARD, CAP TOUCH SOLUTION; Kit Application Type:Sensing - Touch, Proximity; Silicon Manufacturer:NXP; Silicon Core Number:LPC824; Application Sub Type:Capacitive Touch; Kit Contents:Dev Board LPC824, LPC82x Touch Shield, USB Cable; Product Range:-;

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    XTRINSIC-SENSORS-EVK
    XTRINSIC-SENSORS-EVK - Evaluation Kit for NXP Xtrinsic Sensors using FRDM-KL25Z Platform

    2308734

    Evaluation Kit for NXP Xtrinsic Sensors using FRDM-KL25Z Platform

    NXP

    EVAL KIT, XTRINSIC SENSOR + KL25 BOARD; Kit Application Type:Sensing - Sampling Kit / Related Components; Silicon Manufacturer:NXP; Silicon Core Number:KL25Z, MAG3110, MMA8491, MPL3115; Application Sub Type:-; Kit Contents:Xtrinsic Sensor Board, Freedom

    • 615 available for 3 - 4 business days delivery
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    MAXREFDES117#
    MAXREFDES117# - Reference Design Board, Optical Heart Rate and Pulse-Oximetry Monitor, Integrated Red and IR LEDs

    2627165

    Reference Design Board, Optical Heart Rate and Pulse-Oximetry Monitor, Integrated Red and IR LEDs

    MAXIM INTEGRATED PRODUCTS

    REF DES BRD, HEART RATE/PULSE OXIMETER; Silicon Manufacturer:Maxim Integrated Products; Silicon Core Number:MAX30102, MAX14595, MAX1921; Kit Application Type:Sensor; Application Sub Type:Pulse Oximeter & Heart Rate Monitor; Core Architecture:-; Core Sub-

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    DM160225
    DM160225 - Evaluation Board, PC Peripheral, 3DTouchPad, Extends 2D Touch Pad with 3D Gestures

    2448429

    Evaluation Board, PC Peripheral, 3DTouchPad, Extends 2D Touch Pad with 3D Gestures

    MICROCHIP

    DEV BOARD, PCAP SENSOR 3D TOUCH PAD; Kit Application Type:Sensing - Touch, Proximity; Silicon Manufacturer:Microchip; Silicon Core Number:MTCH63104, MGC3130; Application Sub Type:3D Tracking & Gesture Controller; Kit Contents:3DTouchPad, USB Cable, Infor

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    FDC2114EVM .
    FDC2114EVM . - Evaluation Module, FDC2114 12-Bit Capacitive Sensing Solution, Proximity Sensing, 4 Channel

    2535921

    Evaluation Module, FDC2114 12-Bit Capacitive Sensing Solution, Proximity Sensing, 4 Channel

    TEXAS INSTRUMENTS

    EVAL BOARD, FDC2114 CAP-TO-DIGITAL CONV; Kit Application Type:Sensing - Touch, Proximity; Silicon Manufacturer:Texas Instruments; Silicon Core Number:MSP430F5528, FDC2114; Application Sub Type:Capacitance-to-Digital Converter; Kit Contents:Evaluation Boa

    No Longer Stocked

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    FDC1004QEVM .
    FDC1004QEVM . - Evaluation Module, FDC1004-Q1 Automotive 4-Channel Capacitive to Digital Converter, Plug & Play

    2535928

    Evaluation Module, FDC1004-Q1 Automotive 4-Channel Capacitive to Digital Converter, Plug & Play

    TEXAS INSTRUMENTS

    EVAL BRD, FDC1004-Q1 CAP-TO-DIGITAL CONV; Kit Application Type:Sensor Signal Conditioner; Silicon Manufacturer:Texas Instruments; Silicon Core Number:MSP430F5528IRGCT, FDC1004-Q1; Application Sub Type:Capacitance-to-Digital Converter; Kit Contents:Eval B

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    LDC1000EVM
    LDC1000EVM - Evaluation Module, LDC1000 Inductance to Digital Converter for Inductive Sensing Applications, 5V

    2360423

    Evaluation Module, LDC1000 Inductance to Digital Converter for Inductive Sensing Applications, 5V

    TEXAS INSTRUMENTS

    INDUCTIVE SENSING, EVALUATION BOARD; Kit Application Type:Data Converter; Silicon Manufacturer:Texas Instruments; Silicon Core Number:LDC1000; Application Sub Type:Inductance to Digital Converter; Kit Contents:Evaluation Board LDC1000; Product Range:-; S

    No Longer Stocked

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    ADPD105BCPZ
    ADPD105BCPZ - PHOTOMETRIC FRONT END, LFCSP-28

    2725084

    PHOTOMETRIC FRONT END, LFCSP-28

    ANALOG DEVICES

    PHOTOMETRIC FRONT END, LFCSP-28; IC Function:Photometric Front End; Supply Voltage Min:1.7V; Supply Voltage Max:1.9V; IC Package Type:LFCSP; No. of Pins:28Pins; Operating Temperature Min:-40°C; Operating Temperature Max:85°C; Product Range:-; MSL:MSL 3 -

    No Longer Stocked

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    OPT3001EVM .
    OPT3001EVM . - Evaluation Module, OPT3001 Ambient Light Sensor, Digital Output Integrated Circuit

    2471704

    Evaluation Module, OPT3001 Ambient Light Sensor, Digital Output Integrated Circuit

    TEXAS INSTRUMENTS

    EVALUATION BOARD, LIGHT SENSOR; Kit Application Type:Sensing - Navigation, Position; Silicon Manufacturer:Texas Instruments; Silicon Core Number:OPT3001; Application Sub Type:Light to Digital Converter; Kit Contents:Eval Board OPT3001, SM-USB DIG Board,

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    LDC1614EVM .
    LDC1614EVM . - Evaluation Module, LDC1614 28-Bit Inductance to Digital Converter, Sample PCB Sensor Coils

    2471703

    Evaluation Module, LDC1614 28-Bit Inductance to Digital Converter, Sample PCB Sensor Coils

    TEXAS INSTRUMENTS

    EVAL BOARD, LDC1614; Kit Application Type:Sensing - Navigation, Position; Silicon Manufacturer:Texas Instruments; Silicon Core Number:MSP430F5528, LDC1614; Application Sub Type:Sensor; Kit Contents:Eval Board LDC1314; Product Range:-; SVHC:No SVHC (27-Ju

    No Longer Stocked

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    EK-H5
    EK-H5 - Evaluation Kit for SHT2x and SHT7x Humidity and Temperature Sensors

    1855471

    Evaluation Kit for SHT2x and SHT7x Humidity and Temperature Sensors

    SENSIRION

    EVALUATION KIT, HUMIDITY, FOR SHT2X/7X; Kit Application Type:Sensor; Silicon Manufacturer:Sensirion; Silicon Core Number:SHT21; Application Sub Type:Humidity Sensor; Kit Contents:EK-H5 USB Stick, SHT21 Sensor, Sensor Cable; Product Range:-; SVHC:No SVHC

    No Longer Manufactured

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