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Product Information
ManufacturerEDSYN
Manufacturer Part NoSSC 8250
Order Code1182004
Technical Datasheet
Leaded / Lead FreeLead Free
Flux TypeNo Clean and Rosin Flux
Solder Alloy99, 1 Sn, Cu
External Diameter - Metric0.8mm
External Diameter - Imperial0.031"
Melting Temperature230°C
Weight - Metric250g
Weight - Imperial8.818oz
Product Range-
Product Overview
The SSC 8250 is a Solder Wire with low residues SSC flux according to F-SW32. The flux is made of rosin and of various active agents halide-free and carefully selected for their non corrosive power. The result is in a regular and clean soldered surface, where cleaning of printed circuit boards is not necessary, giving reduction of cost production. Soldering lead-free binary alloy used in the electronic industry.
- Very good mechanical strength
- Bright alloy
- Very good electrical conductibility
- Lead free
- Eutectic alloy containing 0.7% copper with a 227°C melting point
Applications
Maintenance & Repair, Industrial
Technical Specifications
Leaded / Lead Free
Lead Free
Solder Alloy
99, 1 Sn, Cu
External Diameter - Imperial
0.031"
Weight - Metric
250g
Product Range
-
Flux Type
No Clean and Rosin Flux
External Diameter - Metric
0.8mm
Melting Temperature
230°C
Weight - Imperial
8.818oz
Technical Docs (2)
Associated Products
3 Products Found
Legislation and Environmental
Country of Origin:
Country in which last significant manufacturing process was carried outCountry of Origin:France
Country in which last significant manufacturing process was carried out
Country in which last significant manufacturing process was carried outCountry of Origin:France
Country in which last significant manufacturing process was carried out
Tariff No:83113000
US ECCN:EAR99
EU ECCN:NLR
RoHS Compliant:Yes
RoHS
RoHS Phthalates Compliant:To be advised
Download Product Compliance Certificate
Product Compliance Certificate
Weight (kg):.26