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Sample Kit, Thermal Interface Solution Envelop, Vertical


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400001   Datasheet
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Technical Documents (1)

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CAD Models - Notice
CAD Models and drawings are provided to you on a revocable limited licence for your internal use only but remain the property of the manufacturer who retain all intellectual property rights and ownership. They are provided to assist you in decision making and as design guide but are not guaranteed to be error free, accurate or up to date and is not intended to be taken as advice.
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Product Overview

Thermal interface solutions sample kit includes WE-TGF thermal gap filler pad (reinforced shape: square; 100 x 100 x 1mm, thermal conductivity = 1 W/(m⋅K)), WE-PCM phase change material (shape: square; 100 x 100 x 0.2mm, thermal conductivity = 1.6W/(m⋅K)), WE-TTT thermal transfer tape (shape: square; 100mm x 100mm x 0.2mm, thermal conductivity: >=1W/(m⋅K), dielectric strength: 4KV/mm, adhesive strength: >= 5.79N/cm), WE-TINS thermally conductive insulator pad (shape: square; 65 x 65 x 0.23mm, thermal conductivity = 1.6W/(m⋅K)).
  • Vertical thermal interfaces envelop
  • Fill a gap to provide a path for the heat energy to flow


WE-TGF thermal gap filler pad, WE-PCM phase change material, WE-TTT thermal transfer tape, WE-TINS thermally conductive insulator pad.

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1 Kit
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1+ HK$782.43
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5+ HK$633.88
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10+ HK$622.29
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